| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for vehicles which is capable of facilitating the lamination of multiple layers without causing the protrusion of an element from the wiring board, and which is capable of improving its cooling efficiency and absorbing dimensional differences. <P>SOLUTION: A rectifier circuit board 30 as a wiring board comprises: a transformer 12 having primary-side and secondary-side coils; diodes 33 for rectification; and a choke coil 13. The transformer 12 and the choke coil 13 are each fixed by a core presser attached to a housing. The rectifier circuit board 30 has the diodes on thin plate wiring patterns 16 and constitutes a multilayer substrate obtained by laminating single-layer substrates formed by resin plates 17 each bonded to the thin plate wiring pattern. The rectifier circuit board 30 not only dissipates heat to the housing which is in contact with a rear face of the thin plate wiring pattern but is also provided with windows formed at positions where the diodes 33 are arranged, while forming the coils with the multilayer substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
