| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip level electromagnetic (EMI:Electromagnetic Interference) shield structure capable of obtaining an electromagnetic interference suppression effect and reducing a chip size, and to provide a method of manufacturing the same. <P>SOLUTION: The chip level electromagnetic (EMI) shield structure has a semiconductor substrate, at least one ground lead, a ground layer, and a connection structure. The ground lead is provided on a first surface of a semiconductor substrate. The ground layer is provided on a second surface of the semiconductor substrate. The connection structure is formed on a sidewall of the semiconductor substrate for connecting the ground layer with the ground lead to form a shield. This EMI shield structure can reduce the chip volume and a cost. <P>COPYRIGHT: (C)2012,JPO&INPIT |
