发明名称 PLATING DEVICE AND PLATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plating device which agitates a plating liquid to uniform the distributions of concentration and temperature of the plating liquid in a plating tank, can be compact and can dispense with the operation expense for agitation. <P>SOLUTION: When driving a pump 14 in a plating device, a plating liquid 3 in a plating liquid tank 6 is supplied to the square tube-shaped nozzles 17 of nozzle structure 15 through a plating liquid-supplying pipe 13 and the like. Since the openings 17a of the tops of the nozzles 17 are opened clockwise, the plating liquid 3 is discharged clockwise from the openings 17a, and the nozzle structure 15 is rotated counterclockwise by a discharge force, thus agitating the plating liquid 3. Accordingly, such constitution does not need an exclusive mechanism for rotating the nozzle structure 15, enables downsizing of the device and can dispense with the operation expense for agitating the plating liquid 3. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012082450(A) 申请公布日期 2012.04.26
申请号 JP20100227445 申请日期 2010.10.07
申请人 TERAMIKROS INC 发明人 ISHIWATARI SHINYA
分类号 C25D21/10;C25D7/12;C25D17/00;C25D17/10 主分类号 C25D21/10
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