| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal spraying apparatus capable of adequately cooling a base material without increasing the size of the apparatus. <P>SOLUTION: When forming a coating film on a coating-film forming face 2a of a semi-conductor module 2 by thermal spraying, the semi-conductor module 2 is held by a holding member 5 so that a part of the semi-conductor module 2 including the coating film forming face 2a is located above the liquid surface of cooling water. Thus, the semi-conductor module 2 can be cooled with cooling water having the specific heat higher than that of a cooling gas such as air, and the cooling efficiency can be enhanced in comparison with a case of cooling the semi-conductor module 2 with air. Therefore, the semi-conductor module 2 does not need to firmly held and fixed by the holding member 5. As a result, a base material can be adequately cooled without increasing the size of the entire thermal spraying apparatus. <P>COPYRIGHT: (C)2012,JPO&INPIT |
