| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem of prior art for forming the dividing grooves only in the uppermost and lowermost layers of a ceramic multilayer wiring board that a breakage may take place obliquely to the dividing groove at an origin and be shifted from the dividing groove at an end point, and a defective wiring board is produced due to barring or chipping thus lowering the manufacturing yield. <P>SOLUTION: Dividing grooves G<SB POS="POST">2</SB>-G<SB POS="POST">6</SB>are formed previously on each package boundary of green sheets 2'-6' excepting the green sheet 1' on the uppermost layer and the green sheet 7' on the lowermost layer. The green sheets 1'-7' are then pressed and laminated thus forming the dividing grooves G<SB POS="POST">1</SB>, G<SB POS="POST">7</SB>on each package boundary of the green sheet 1' on the uppermost layer and the green sheet 7' on the lowermost layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
