PHOTONICS MODULE AND METHOD OF MANUFACTURING

摘要

An improved photonics module includes a Silicon motherboard having a plurality of v-grooves that collimate and optically align a laser diode emission is held within an enclosure that includes two or more positioning portions that locate and guide the Silicon motherboard in the desired position within the enclosure. The enclosure acts as a heat sink that provides stability and aids in wicking Silicon motherboard mounting material such damage to the Silicon motherboard by the mounting material is avoided. Methods of making the improved photonics module are also disclosed.