ENCAPSULATING AGENT FOR OPTICAL SEMICONDUCTOR DEVICES, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

摘要

Provided is an encapsulating agent for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulating agent when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. This encapsulating agent for optical semiconductor devices contains: a first organopolysiloxane which does not have a hydrogen atom that is bonded to a silicon atom and has an alkenyl group that is bonded to a silicon atom and an aryl group that is bonded to a silicon atom; and a second organopolysiloxane which has a hydrogen atom that is bonded to a silicon atom and an aryl group that is bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound that has a titanium atom.