| 摘要 |
PURPOSE: A solder injection device and method are provided to improve the productivity of a solder implantation process by rapidly discharging a template without coagulating the solder of a nozzle assembly. CONSTITUTION: A first pick-up part(150) supplies a cover member(20) to a chuck(110). A nozzle assembly(200) is arranged on the top of the chuck. The nozzle assembly and a template(10) are touched each other. A driving part offers a relative sliding motion between nozzle assembly and the template which are touched. A second pick-up part(160) discharges the cover member which is used for the cover of a slit.
|
