发明名称 LIGHT EMITTING DIODE PACKAGE, AND BACKLIGHT UNIT AND DISPLAY DEVICE USING THE SAME
摘要 <p>A light emitting diode package may be provided that includes a light emitting diode chip and a heat sink. Heat generated from the light emitting diode chip may be radiated to the outside using the heat sink.</p>
申请公布号 EP2443677(A1) 申请公布日期 2012.04.25
申请号 EP20100789617 申请日期 2010.03.10
申请人 LG ELECTRONICS INC. 发明人 SEO, BU WAN
分类号 H01L33/64 主分类号 H01L33/64
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