| 摘要 |
A switching assembly is disclosed for a high voltage aircraft ignition system. The switching assembly includes a ceramic substrate and switch die that includes an anode bonded to an electrical pad on the ceramic substrate. The switch die includes a semiconductor device having a plurality of interleaved gates and cathodes, and includes a ceramic cap having at least one gate pad connected to the gates and at least one cathode pad connected to the cathodes. The switching assembly includes leads connected to the gate pad, the cathode pad, and the electrical pad on the substrate. The switch die and a portion of the leads are potted to form the completed assembly. |
