| 摘要 |
<p>The device has a cooling body resting against an electronic component, and a carrier device i.e. multilayer-circuit board, with an upper side and a lower side. A flat spring (10) is arranged on the lower side such that the spring is engaged with holding units (11a, 12a) by recesses in the carrier device. The body includes locking units for locking the holding units. The spring is pre-embossed such that the spring centrically introduces contact force (F) under the component in the carrier device in a tensioned condition. A seam (14) and a rivet (15) are arranged on a body of the spring.</p> |
