The present invention relates to an electrolyte for the electrochemical deposition of palladium or palladium alloys on metallic or conductive substrates. The invention likewise relates to a corresponding electroplating process using this electrolyte and specific palladium salts which can be advantageously used in this process.
申请公布号
EP2283170(B1)
申请公布日期
2012.04.25
申请号
EP20080758401
申请日期
2008.05.07
申请人
UMICORE GALVANOTECHNIK GMBH
发明人
BERGER, SASCHA;OBERST, FRANK;SIMON, FRANZ;MANZ, UWE;WEYHMUELLER, BERND;BRONDER, KLAUS
