| 摘要 |
PURPOSE: A heat-radiant coating composition and a manufacturing apparatus for semiconductor using thereof are provided to rapidly remove heat from a heating part of the manufacturing apparatus for semiconductor. CONSTITUTION: A heat-radiant coating composition comprises 50-80 parts by weight of more than 2 kinds of inorganic compound, 30-55 parts by weight of carbon-based material, 10-25 parts by weight of metal silicate, and 100.0 parts by weight of solvent. The inorganic compound includes nitride and oxide. The nitride is more than one kind which is selected from aluminum nitrides and boron nitride. The oxide is more than one kind which is selected form alumina, zirconia, titania, and silica. The carbon-based material is more than one kind which is selected from graphite, carbon nanotubes, and graphene. |
