| 摘要 |
PURPOSE: A printed circuit board is provided to reduce process time by sticking a solder ball to a Borland part without minute align to a solder ball attachment apparatus and to reduce initial investment costs by not using a flux doping device. CONSTITUTION: A printed circuit board(110) comprises a substrate body(111), a circuit pattern(120), and a bonding layer(130). The printed circuit board comprises a solder mask(140). The circuit pattern is respectively arranged on one side or the other side(111b) of the substrate body. The circuit pattern comprises a bond finger and a Borland(122) which is electrically connected to the bond finger. The bonding layer comprises an adhesion body(132) and conductive via(134). The conductive via comprises one among Cu, Au, Ag, and Al. The solder mask is formed on the top of the bonding layer.
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