发明名称 LIGHT EMITTING DEVICE, METHOD FOR FABRICATING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
摘要 <p>PURPOSE: A light emitting device and a manufacturing method thereof, and a light emitting device package and a lighting system are provided to minimize amount of light which is totally reflected on the surface of a light emitting structure layer by forming a light extraction pattern on the upper side of the light emitting structure layer. CONSTITUTION: A light emitting structure layer(135) which creates light is formed on a conductive supporting member(175). The light emitting structure layer comprises a first electrical conduction semiconductor layer(110), an active layer(120), and a second electrical conduction semiconductor layer(130). An electrode(115) including a gallium barrier layer(113) and a metal electrode layer(114) is formed on the light emitting structure layer. A junction layer(170) including bonding metal is formed on the conductive supporting member. A reflecting layer(160) is formed on the junction layer.</p>
申请公布号 KR20120039412(A) 申请公布日期 2012.04.25
申请号 KR20100101109 申请日期 2010.10.15
申请人 LG INNOTEK CO., LTD. 发明人 CHOI, KWANG KI;LEE, SANG YOUL;SONG, JUNE O;MOON, JI HYUNG;JUNG, SE YEON;SUNG, TAE YEON;JEON, JOON WOO;PARK, SEONG HAN
分类号 H01L33/36 主分类号 H01L33/36
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