Lighting assembly, method for its manufacture and lighting device

摘要

The method involves joining an illuminating component (32) and an illuminating chip socket (30) using a bonding material (106), such that light guide materials of the illuminating component and illuminating chip socket are bonded together. The excessive bonding material is discharged through an annular groove (50), a gutter (56) and a flow channel (60) provided in the illuminating chip socket, at the time of joining the illuminating component and illuminating chip socket. Independent claims are included for the following: (1) light emitting arrangement; and (2) lighting device.