| 摘要 |
A light emitting diode (LED) package structure (100) includes a substrate (110), at least one enclosure (120) made of a transparent material, an LED (130), a first package material (140), and a second package material (160). The enclosure is disposed on a surface of the substrate, and forms a configuration area for disposing the LED therein. The first package material made of a transparent material is disposed in the configuration area (121) and covers the LED. The second package material containing a fluorescent material covers the enclosure, the LED, and the first package material. |
