发明名称 |
Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads |
摘要 |
Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.). |
申请公布号 |
US8163819(B2) |
申请公布日期 |
2012.04.24 |
申请号 |
US20100767857 |
申请日期 |
2010.04.27 |
申请人 |
GRAHAM DAVID CHRISTOPHER;HOLT, JR. GARY ANTHONY;LAURER JONATHAN HAROLD;MASSIE, II JOHNNY DALE;WALDECK MELISSA MARIE;WEAVER SEAN TERRENCE;WELLS RICH;LEXMARK INTERNATIONAL, INC. |
发明人 |
GRAHAM DAVID CHRISTOPHER;HOLT, JR. GARY ANTHONY;LAURER JONATHAN HAROLD;MASSIE, II JOHNNY DALE;WALDECK MELISSA MARIE;WEAVER SEAN TERRENCE;WELLS RICH |
分类号 |
C08L63/00;C09J163/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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