发明名称 |
Spherical solder reflow method |
摘要 |
The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls. |
申请公布号 |
US8162203(B1) |
申请公布日期 |
2012.04.24 |
申请号 |
US201113030594 |
申请日期 |
2011.02.18 |
申请人 |
GRUBER PETER A.;NAH JAE-WOONG;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GRUBER PETER A.;NAH JAE-WOONG |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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