发明名称 Heat sink assembly
摘要 An exemplary heat sink assembly includes a heat sink and a clip resiliently clamping the heat sink on a printed circuit board. The heat sink includes a base and a plurality of first fins and two central second fins extending upwardly from the base. The clip includes a locating portion fixed between the second fins of the heat sink, a pair of elastic portions extending outwardly from opposite ends of the locating portion and oriented towards substantially opposite directions, and two hooks extending outwardly from ends of the operating members, respectively. An acute included angle is formed between each elastic portion and the locating portion of the clip in an original relaxed position, and the acute included angles become approximately right angles when the clip is preassembled in the heat sink with the elastic portions abutting the second fins.
申请公布号 US8164905(B2) 申请公布日期 2012.04.24
申请号 US20100915009 申请日期 2010.10.29
申请人 YANG JIAN;FU ZHUN PRECISION INDUSTRY (SHEN ZHEN ) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 YANG JIAN
分类号 H05K7/20;F28F7/00;H01L23/34 主分类号 H05K7/20
代理机构 代理人
主权项
地址