发明名称 LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
摘要 <p>High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.</p>
申请公布号 KR20120039052(A) 申请公布日期 2012.04.24
申请号 KR20127005227 申请日期 2010.07.30
申请人 HENKEL CORPORATION 发明人 PATEL JAGRUTI B.;EODICE ANDREA KEYS;LOW YEW GUAN
分类号 C09J123/08;C09J5/06;C09J123/20;C09J191/06 主分类号 C09J123/08
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