发明名称 |
Fluoride-modified silica sols for chemical mechanical planarization |
摘要 |
A chemical-mechanical planarization composition containing surface-modified abrasive particles such as silica where at least a portion of the surface of the particles has bound thereto a surface-modifying aluminum-containing stabilizer and fluoride that is used to polish semiconductor substrates. The use of a CMP slurry containing surface-modifying aluminum-containing stabilizer and fluoride bound to a silica abrasive provides high metal polishing rates relative to the removal rate of a dielectric. |
申请公布号 |
US8163049(B2) |
申请公布日期 |
2012.04.24 |
申请号 |
US20070783191 |
申请日期 |
2007.04.06 |
申请人 |
SIDDIQUI JUNAID AHMED;DUPONT AIR PRODUCTS NANOMATERIALS LLC |
发明人 |
SIDDIQUI JUNAID AHMED |
分类号 |
B24D3/02;C09C1/68;C09K3/14 |
主分类号 |
B24D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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