发明名称 Noncontact IC tag label and method of manufacturing the same
摘要 This invention provides a thin type of noncontact IC tag label that allows materials costs to be reduced without using an antenna-supporting base film. The noncontact IC tag label includes an electroconductive layer of a required antenna pattern shape, an IC chip mounted on one face of the electroconductive layer, and a surface protection sheet supporting the electroconductive layer and the IC chip from a side of the one face of the electroconductive layer via a first pressure-sensitive adhesive layer. An adhesive resin layer having the same shape as the antenna pattern shape of the electroconductive layer is provided on the other face of the electroconductive layer. The adhesive resin layer is temporarily bonded in separable manner onto a release paper formed from paper or a plastic base material.
申请公布号 US8162231(B2) 申请公布日期 2012.04.24
申请号 US20070447986 申请日期 2007.10.16
申请人 OGATA TETSUJI;SAKATA HIDETO;DAI NIPPON PRINTING CO., LTD. 发明人 OGATA TETSUJI;SAKATA HIDETO
分类号 G06K19/06 主分类号 G06K19/06
代理机构 代理人
主权项
地址