发明名称 |
Optical semiconductor device encapsulated with silicone resin |
摘要 |
An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone resin composition that encapsulates the optical semiconductor element, wherein the amount of (ΦSiO3/2) units (wherein Φ represents a phenyl group) within the cured product, determined by solid 29Si-DD/MAS analysis, is within a range from 0.13 mol/100 g to 0.37 mol/100 g.
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申请公布号 |
US8164202(B2) |
申请公布日期 |
2012.04.24 |
申请号 |
US20100710593 |
申请日期 |
2010.02.23 |
申请人 |
KASHIWAGI TSUTOMU;HONGO TAKAHIRO;SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KASHIWAGI TSUTOMU;HONGO TAKAHIRO |
分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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