发明名称 Enclosure of electronic device
摘要 An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel.
申请公布号 US8164900(B2) 申请公布日期 2012.04.24
申请号 US20100938602 申请日期 2010.11.03
申请人 SUN HONG-ZHI;CHEN CHEN;LI YANG;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 SUN HONG-ZHI;CHEN CHEN;LI YANG
分类号 H05K7/20 主分类号 H05K7/20
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