发明名称 Semiconductor device and method of manufacturing thereof
摘要 A semiconductor device is provided in which the contact resistance of the interface between an electrode and the semiconductor substrate is reduced. The semiconductor device includes a 4H polytype SiC substrate, and an electrode formed on a surface of the substrate. A 3C polytype layer, which extends obliquely relative to the surface of the substrate and whose end portion at the substrate surface is in contact with the electrode, is formed at the surface of the substrate. The 3C polytype layer has a lower bandgap than 4H polytype. Hence, electrons present in the 4H polytype region pass through the 3C polytype layer and reach the electrode. More precisely, the width of the passageway of the electrons is determined by the thickness of the 3C polytype layer. Consequently, with this semiconductor device, in which the passageway of the electrons is narrow, the electrons are able to reach the electrode at a speed close to the theoretical value, by the quantum wire effect. In this way, the contact resistance can be reduced in the semiconductor device.
申请公布号 US8164100(B2) 申请公布日期 2012.04.24
申请号 US20080338151 申请日期 2008.12.18
申请人 FUJIWARA HIROKAZU;KONISHI MASAKI;OKUNO EIICHI;TOYOTA JIDOSHA KABUSHIKI KAISHA;DENSO CORPORATION 发明人 FUJIWARA HIROKAZU;KONISHI MASAKI;OKUNO EIICHI
分类号 H01L29/72 主分类号 H01L29/72
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