| 摘要 |
The method for producing glass-coated electronic components includes processing a lead-free glass with a liquid to form a suspension, applying the suspension on an electronic component body and subsequently sintering the component body with the suspension on it. The lead-free glass contains, in % by weight, SiO2, 3-12; B2O3, 15-<25; Al2O3, 0-6; Cs2O, 0-5; MgO, 0-5; BaO, 0-5; Bi2O3, 0-5; CeO2, 0.01-1; MoO3, 0-1; Sb2O3, 0-2 and ZnO, 50-65. The method can be used to passivate electronic components. |
