| 摘要 |
The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt% of lead; 0.3 to 0.8 wt% of aluminum; 0.01 to 0.1 wt% of bismuth; 1 to 4 wt% of silicon; 0.1 to 1 wt% of tin; and more than 93.8% of copper and zinc, wherein the copper is more than 74.8 wt%, and the zinc is in an amount ranging from 15.6 to 19 wt%. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions.
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