SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to laminate a plurality of the semiconductor devices with different sizes by including penetration electrodes which have different protrusion heights from each other. CONSTITUTION: A semiconductor device comprises a first semiconductor chip(110a), a second semiconductor chip(120), and a third semiconductor chip(130). The first semiconductor chip comprises a first penetration electrode which has a first protrusion height and a second penetration electrode which has a second protrusion height. The second semiconductor chip is electrically connected to the first penetration electrode. The third semiconductor chip is electrically connected to the second penetration electrode.