| 摘要 |
PURPOSE: An adhesive varnish is provided to ensure high thermal conductivity, low dielectric loss, improved rheological property, improved thermal stability, low manufacturing costs and high yield. CONSTITUTION: An adhesive varnish is formed by mixing an epoxy resin precursor(2), bihardener mixture(3), catalyst(4), flow modifier(5), inorganic filler(6) with high thermal conductivity, and solvent(7). The epoxy resin precursor is formed by mixing two epoxy resins. The epoxy resins are selected from trifunctional epoxy resin, rubber-modified or dimer acid-modified epoxy resin, bromine-containing epoxy resin, halogen-free phosphorous-containing epoxy resin, halogen-free, phosphorous-free epoxy resin, ring connection/halogen-free epoxy resin, a bisphenol A epoxy resin.
|
