发明名称 APPARATUS FOR CHUCKING SUBSTRATE
摘要 PURPOSE: A substrate chucking apparatus is provided to simply comprise a substrate processing device by supporting a substrate with a mask. CONSTITUTION: A substrate is supported on one side of a first plate(110). A vacuum groove(115) opened with a lattice type is formed on the upper side of the first plate. A second plate(130) is downwardly separated from the first plate. A sidewall(170) is supported in the edge of the second plate. A step(171) is formed on the inner side of the sidewall. A chucking member(191) is installed on one side of the first plate.
申请公布号 KR20120038217(A) 申请公布日期 2012.04.23
申请号 KR20100099854 申请日期 2010.10.13
申请人 LIGADP CO., LTD. 发明人 SON, HYOUNG KYU;CHOI, EUN YOUL;KIM, SANG LEOUL;LEE, JAE MOO;KANG, CHAN HO
分类号 H01L21/683;B65G49/06;H01L21/687;H05K13/04 主分类号 H01L21/683
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