发明名称 |
APPARATUS FOR CHUCKING SUBSTRATE |
摘要 |
PURPOSE: A substrate chucking apparatus is provided to simply comprise a substrate processing device by supporting a substrate with a mask. CONSTITUTION: A substrate is supported on one side of a first plate(110). A vacuum groove(115) opened with a lattice type is formed on the upper side of the first plate. A second plate(130) is downwardly separated from the first plate. A sidewall(170) is supported in the edge of the second plate. A step(171) is formed on the inner side of the sidewall. A chucking member(191) is installed on one side of the first plate.
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申请公布号 |
KR20120038217(A) |
申请公布日期 |
2012.04.23 |
申请号 |
KR20100099854 |
申请日期 |
2010.10.13 |
申请人 |
LIGADP CO., LTD. |
发明人 |
SON, HYOUNG KYU;CHOI, EUN YOUL;KIM, SANG LEOUL;LEE, JAE MOO;KANG, CHAN HO |
分类号 |
H01L21/683;B65G49/06;H01L21/687;H05K13/04 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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