BUILD-UP FILM STRUCTRUE AND CIRCUIT BOARD MANUFACTURED USING THE BUILD-UP FILM STRUCTURE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE BUILD-UP FILM STRUCTURE

摘要

PURPOSE: A build up film structure, a circuit board manufactured using the same, and a circuit board manufacturing method using the build up film structure are provided to increase exfoliation intensity between an insulating film and a circuit pattern by improving combining strength between the circuit pattern and the other surface of the insulating film. CONSTITUTION: An insulating film(110) comprises a first film(120) and a second film(130) which are combined to each other. The first film includes first filler which has a regular shape. The second film includes second filler(134) which has a irregular shape. A carrier film(150) is laminated on the upper surface of the insulating film. A protective film(140) is laminated on the lower surface of the insulating film.