| 发明名称 |
WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE |
| 摘要 |
<p>Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.</p> |
| 申请公布号 |
KR20120038449(A) |
申请公布日期 |
2012.04.23 |
| 申请号 |
KR20127001582 |
申请日期 |
2010.07.27 |
| 申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI |
发明人 |
SHIMADU HITOSHI;KONDOU KAZUNORI;SAWADA TAKEHIKO;HAYAKAWA TAKAHIRO;ASAI TOMOAKI;YAMAUCHI RYOU |
| 分类号 |
H01L23/12;H01L23/36;H05K1/02;H05K7/20 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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