A MANUFACTURING METHOD OF SMD LEAD FRAME OF LED

摘要

PURPOSE: A manufacturing method of a surface mount device lead frame of an LED is provided to improve light emission efficiency by forming a substrate which is comprised of white plastic with high reflectivity. CONSTITUTION: A plurality of lead regions which respectively includes one or more pins is punched on a metal substrate(S62). A substrate is formed by performing a first injection molding process on each lead region(S64). A waste die is eliminated by cutting and punching the die(S65). A two-section die punching process is performed and the pins on a plurality of lead regions are respectively connected to the substrate(S66). An insulation cashing is formed by performing a second injection molding process on the substrate. The pin folded on the substrate is completely covered by the insulation cashing(S67). A plurality of surface mount device lead frames of an LED is acquired by eliminating the waste die through die punching and cutting processes(S68).