| 摘要 |
In order to integrate substrate holders respectively holding semiconductor substrates such that the semiconductor substrates are sandwiched in a layered state, a fixing mechanism is needed to fix the substrate holders to each other. The contact points in the fixing mechanism can generate dust. Therefore, provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate; an engagement receiving member provided on the second substrate holder at a position facing the engaging member when the first substrate holder and the second substrate holder face each other and sandwich the first substrate and the second substrate; and a buffer portion provided on at least one of a contact portion of the engaging member and a contact portion of the engagement receiving member. |
