| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the thickness of a layer from becoming uneven because a lot of phosphor powder is used in a white LED package. <P>SOLUTION: An LED package structure 100a comprises a fluorescent substrate 110, a first conductive pattern 120, a second conductive pattern 130, at least one conductive element, and an LED chip 150. The fluorescent substrate 110 has a first surface 112, and a second surface 114 facing the first face. The fluorescent substrate contains a mixture of a fluorescent material and a glass material. The first conductive pattern is provided on the first surface. The second conductive pattern is provided on the second surface. The conductive element penetrates the fluorescent substrate and connects the first and second conductive patterns. The LED chip is arranged on the second surface and has a light extraction surface connected to the second conductive pattern. The LED chip is connected electrically with the first conductive pattern via the conductive element. <P>COPYRIGHT: (C)2012,JPO&INPIT |
