Fremgangsmåde til aktivering før ætsning af overflader af polyolefingenstande, der skal kemisk metalpletteres.

摘要

1,175,348. Treating polyolefines. OKUNO CHEMICAL INDUSTRY CO. Ltd. 4 July, 1968 [13 July, 1967], No. 31998/68. Heading C3P. [Also in Division C7] A process for chemically plating a polyolefine resin surface involves wetting a surface of the resin with a stable solution containing from 10 to 90% by weight of an organic peroxide, decomposing the peroxide thereon, etching the wetted surface and then chemically plating the etched surface. Polyolefine resins: ethylene, propylene and butylene homopoly. mers, and ethylene - propylene copolymers. Organic peroxides: compounds of the formulµ: (iii) (R3CO) 2 O 2 ; and (iv) R3COOOR2, wherein R1 is a monovalent organic group, R2 is hydrogen or a monovalent organic group, R3CO is an acyl group, and X is hydrogen or Many peroxide compounds are specifically mentioned. Organic solvents: methyl, ethyl and isopropyl alcohols, acetone, methylethyl ketone, n-heptane, benzene, xylene, toluene, cumene, methyl acetate and dimethyl phthalate. Water may be used as or in the solvent provided the stability of the peroxide is not lost. The polymers may be treated in moulded forms (specified). Decomposition of the peroxide may be effected with inorganic acid or U.V. light, or by heating in air or a solution of alkali hydroxide or chloride. Thereafter, the polyolefine resin is etched with a sulphuric acid-potassium dichromate (or permanganate) mixture, sensitized with 35% hydrochloric acid containing stannous chloride or sulphate, and activated with 35% hydrochloric acid containing a water-soluble inorganic salt of gold, silver, palladium or platinium, e.g. palladium chloride or sulphate, in preparation for the chemical plating. Examples disclose the treatment of 5 cm. x 10 cm. x 0À3 cm. plates of propylene homopolymer with 10% aqueous solution of peracetic acid, 10% ethanol solution of benzoyl peroxide, 25% ethanol solution of tert-butyl-peroxyisobutylate and 30% ethanol solutions of cumyl hydroperoxide, diisopropyl benzene hydroperoxide, 2,5. dimethyl hexane - 2,5 - dihydroperoxide and p-menthane hydroperoxide, respectively, and of ethylene homopolymer and ethylene-propylene copolymer with 30% ethanol solutions of cumene hydroperoxide. The plates were treated to decompose the peroxide attached to the plate surface and were etched, sensitized activated, chemically plated and electroplated. In one example, an activated plate of propylene homopolymer was dipped in a nickel sulphate bath (specified) of pH 9À5 and the resulting plate was electroplated in a copper sulphate bath (specified) at a cathode current density of 3A/dm2 to produce a copper layer of 20 Á thickness, was further electroplated in a nickel sulphate bath (specified) to produce a nickel layer of 7 Á thickness followed by an electroplating in a chromic acid bath (specified) at a cathode current density of 20 A/dm2 to produce a chromium layer of 0À2 Á thickness.