发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a cleaning method for an SiC epitaxial growth device. <P>SOLUTION: A cleaning method comprises: a film forming step of forming an SiC epitaxial film on a processed substrate placed in a reaction chamber; a modification step of supplying a first gas (for example, a chlorine gas) to modify the SiC film deposited on a member provided in the reaction chamber in the film forming step; and a removal step of supplying a second gas (for example, a fluorine-based gas, an oxidation gas, or a hydrogen gas) to remove a deposition film modified in the modification step. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012080035(A) 申请公布日期 2012.04.19
申请号 JP20100226550 申请日期 2010.10.06
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 FUKUDA MASANAO;SASAKI SHINYA;IMAI YOSHINORI;MORIMITSU KAZUHIRO;NAKAJIMA SADAO
分类号 H01L21/205;C23C16/44;C30B29/36 主分类号 H01L21/205
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