发明名称 |
Slurry For Chemical Mechanical Polishing |
摘要 |
The present invention relates to a slurry for chemical mechanical polishing, comprising an abrasive; an oxidant; an organic acid; and a polymeric additive comprising polyolefin-polyalkyleneoxide copolymer, wherein the polyolefin-polyalkyleneoxide copolymer comprises a polyolefin repeat unit and two or more polyalkyleneoxide repeat units, and at least one polyalkyleneoxide repeat unit is branched. |
申请公布号 |
US2012094490(A1) |
申请公布日期 |
2012.04.19 |
申请号 |
US201013260239 |
申请日期 |
2010.04.22 |
申请人 |
CHOI EUN-MI;SHIN DONG-MOK;CHO SEUNG-BEOM;LG CHEM. LTD |
发明人 |
CHOI EUN-MI;SHIN DONG-MOK;CHO SEUNG-BEOM |
分类号 |
H01L21/306;C09K13/00;C09K13/06 |
主分类号 |
H01L21/306 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|