| 摘要 |
The solder film (202) comprises a base surface, a first recess (204) arranged in the base surface, and a second recess arranged at an edge of the base surface. The base surface, the first recess and the second recess are dimensioned such that the solder film arranges between two components to be joined at a predetermined end face with an opening (214) during melting. The end face is a joining surface of the components to be soldered. A center of the first recess is correspondingly arranged to a center of the opening in the end face. The solder film (202) comprises a base surface, a first recess (204) arranged in the base surface, and a second recess arranged at an edge of the base surface. The base surface, the first recess and the second recess are dimensioned such that the solder film arranges between two components to be joined at a predetermined end face with an opening (214) during melting. The end face is a joining surface of the components to be soldered. A center of the first recess is correspondingly arranged to a center of the opening in the end face. The opening corresponds to one end of a tool component to be soldered in a joining surface of an internal cooling channel extending with the solder film. The second recess corresponds to a flute located at an edge. The dimensions are predetermined as a function of the thickness of a solder layer using capillary and diffusion movements during the melting process. The solder film has a thickness of 20-100 mu m, and is based on a silver-or nickel-solder. An independent claim is included for a method for connecting two components of a machining tool. |
