| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a polyamide-imide resin composition curable at a lower temperature than that of conventional polyamide-imide resin composition containing an epoxy resin, and obtainable of sufficient heat resistance, mechanical strength and adhesive strength; a prepreg using the polyamide-imide resin composition; a metal foil with a resin; and an adhesive film and a metal foil-clad laminate. <P>SOLUTION: This polyamide-imide resin composition includes a polyamide-imide resin and a multifunctional glycidyl compound, where the polyamide-imide is represented by general formula (1) (wherein Ar represents an aromatic ring having optionally a substituent other than a carboxy group; and n denotes an integer of 1 or more). <P>COPYRIGHT: (C)2012,JPO&INPIT |
