发明名称 LASER BEAM MACHINING DEVICE, METHOD OF MACHINING WORKPIECE, AND METHOD OF DIVIDING WORKPIECE
摘要 <P>PROBLEM TO BE SOLVED: To achieve more certain division of a workpiece configured by forming a dissimilar material layer on a substrate. <P>SOLUTION: A machining method for forming a division starting point on a workpiece includes: a placing step of placing the workpiece on a stage movable to the first and second directions; a preliminary machining step of exposing a base substrate in a region to be irradiated by irradiating with a laser beam for preliminary machining emitted from a prescribed light source while moving the stage to the first direction; and a regular machining step of generating cleavage or parting of the base substrate between the regions to be irradiated by irradiating the workpiece with the laser beam for regular machining while moving the stage to the second direction in such a manner that in the laser beam for regular machining which is an ultrashort pulsed light having a pulse width of a picosecond order emitted from a prescribed light source, the region to be irradiated for each unit pulsed light is formed discretely in the exposed portion of the base substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012076093(A) 申请公布日期 2012.04.19
申请号 JP20100221589 申请日期 2010.09.30
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 NAGATOMO SHOHEI;NAKATANI IKUYOSHI;SUGATA MITSURU
分类号 B23K26/00;B23K26/04;B23K26/38;B23K26/40;B28D5/00;H01L21/301 主分类号 B23K26/00
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