The present invention relates to a wire tool comprising: a wire containing metal; a plating layer formed on the surface of the wire; a plurality of diamond particles arranged on the plating layer; and a first protection layer which covers the diamond particles, and a second protection layer formed between the first protection layer and the plating layer.
申请公布号
WO2011145858(A3)
申请公布日期
2012.04.19
申请号
WO2011KR03615
申请日期
2011.05.17
申请人
ILJIN DIAMOND CO.,LTD.;RYOO, MIN HO;MOON, HWAN GYUN;JEONG, YONG HWA