Method of manufacturing printed circuit boad

摘要

Disclosed herein is a method of manufacturing a printed circuit board, including: forming a first circuit wiring layer on a substrate; forming an organic metal compound layer on the surface of the first circuit wiring layer; performing a surface treatment on the surface of the organic metal compound layer; forming an insulating layer on the first circuit wiring layer including the organic metal compound layer; and forming a second circuit wiring layer on the insulating layer.