| 摘要 |
<p>An LED module (101) is provided with: an LED chip (200) having a submount substrate (210) comprising Si, and a semiconductor layer (220) laminated on the submount substrate (210); and a white resin (280) that covers at least part of the side surfaces of the submount substrate (210) connected to the surface where the semiconductor layer (220) is laminated, and through which light from the semiconductor layer (220) does not pass. Such a configuration provides an LED module that enables the high brightness of the LED module (101) to be achieved.</p> |
