| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which makes its cured products high in hardness, is excellent in heat resistance, UV resistance, strength and bendability, durable in a reflow mounting ability and under heat cycle conditions, and suitable for an electronic material field and photosemiconductor sealing; and to provide an epoxy silicone resin to be mixed with the composition. <P>SOLUTION: The thermosetting resin composition contains, as the essential components, an epoxy silicone resin, a curing agent and a curing accelerator. The epoxy silicone resin to be used in the composition is prepared as follows: a hemiester (A2) having carboxyl groups on its both terminals is made to react with an alicyclic epoxy resin (A3), which is liquid in room temperature, under the conditions that the ratio in mole of the carboxyl groups of (A2) to the epoxy groups of (A3) is 1:2-1:10, the hemiester (A2) being obtained by a reaction between straight-chain polysiloxane, which has alcoholic hydroxy groups on its both terminals, and acid anhydride. <P>COPYRIGHT: (C)2012,JPO&INPIT |
