| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve high-accuracy alignment of a sample and high-sensitivity inspection for a semiconductor wafer having an alignment mark which is under the condition where the alignment mark is hard to be pattern-matched. <P>SOLUTION: A foreign matter inspection device including analysis means which can measure the pattern width and can acquire the luminance distribution for image data of an alignment mark, and image processing means which enables integration processing, subtraction processing, binarization processing, expansion processing and contraction processing includes processing the image data to make the alignment mark clear, and then pattern-matching the alignment mark. <P>COPYRIGHT: (C)2012,JPO&INPIT |
