| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow compatibility between heat radiation performance and strength of a heat radiation fin of a base integrated substrate device with a fin. <P>SOLUTION: A base integrated substrate 2 is equipped with a fin for cooling, to which an insulating substrate 11 on which a circuit metal plate 12 is mounted is joined. A plurality of first plate-like heat radiation fins 15 and a second plate-like heat radiation fins 16 which is shorter than the first heat radiation fin 15, are fitted in parallel on the surface opposite to the surface to which the insulating substrate 11 is joined, with a gap in between. Between the first heat radiation fins 15 which adjoin each other, the second heat radiation fin 16 arranged parallel to the first heat radiation fin 15 is arranged side by side. A base integrated substrate device 1 with a fin is provided, which allows compatibility between heat radiation performance and strength by attaching a water-cooling jacket that encloses the first heat radiation fin 15 and the second heat radiation fin 16. <P>COPYRIGHT: (C)2012,JPO&INPIT |
