发明名称 |
LASER BEAM MACHINING DEVICE, METHOD FOR MACHINING WORKPIECE, AND METHOD FOR DIVIDING WORKPIECE |
摘要 |
<P>PROBLEM TO BE SOLVED: To achieve more certain division of a workpiece configured by forming a dissimilar material layer on a substrate. <P>SOLUTION: A machining method for forming a division starting point on the workpiece includes: a placing step of placing the workpiece on a stage; a preliminary machining step of exposing a base substrate at the position of a first preset machining line by irradiating with a first laser beam from a first light source along the first preset machining line; and a regular machining step of generating cleavage or parting of the base substrate between the regions to be irradiated by irradiating the exposed portion of the base substrate with a second laser beam which is an ultrashort pulsed light having a pulse width of a picosecond order from a second light source in such a manner that an irradiation region for each unit pulsed light is formed discretely. The preliminary and regular machining processes are performed while moving the stage to a first direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012076090(A) |
申请公布日期 |
2012.04.19 |
申请号 |
JP20100221294 |
申请日期 |
2010.09.30 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
NAGATOMO SHOHEI;NAKATANI IKUYOSHI;SUGATA MITSURU |
分类号 |
B23K26/00;B23K26/04;B23K26/40;B28D5/00;H01L21/301 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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