发明名称 |
LASER BEAM MACHINING DEVICE, LASER BEAM MACHINING DATA-SETTING DEVICE, LASER BEAM MACHINING DATA-SETTING METHOD, LASER BEAM MACHINING CONDITION-SETTING PROGRAM, COMPUTER-READABLE RECORDING MEDIUM, AND EQUIPMENT USED FOR RECORDING |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of easily designating a three-dimensional configuration of a surface to be machined. <P>SOLUTION: The laser beam machining device includes: a machining condition-setting portion for designating a three-dimensional configuration and a machining pattern of the surface to be machined; a machining data-forming portion for forming a laser beam machining data for the surface to be machined in accordance with the machining condition designated in the machining condition-setting portion; and a machining image-displaying portion capable of displaying an image of a laser beam machining data formed in the machining data-forming portion in two dimension and/or three dimensions. Furthermore, the machining condition-setting portion is provided with: a machining pattern input means for inputting the machining pattern as two-dimensional information; and a machining surface profile input means for inputting profile information which represents the three-dimensional configuration of the surface to be machined. The machining surface profile input means is configured to be able to specify the basic diagram representing the three-dimensional surface to be machined which serves as a reference for converting the two-dimensional information of the machining pattern inputted through the machining pattern input means into a three-dimensional laser beam machining data in accordance with the three-dimensional surface to be machined. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012076147(A) |
申请公布日期 |
2012.04.19 |
申请号 |
JP20110238069 |
申请日期 |
2011.10.29 |
申请人 |
KEYENCE CORP |
发明人 |
MORISONO KOTARO;IDAKA MAMORU;YAMAKAWA HIDEKI;HASEBE HIROYASU |
分类号 |
B23K26/00;B23K26/04;B23K26/08;G02B26/10 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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